Appeal No. 97-0598
Application 08/322,670
16, 18 and 19.
The disclosed invention relates to a charge transfer
plate of an electronic device, through which electrical
signals are simultaneously transmitted. In order to improve
spatial resolution, the charge transfer density of the plate
is substantially increased above 900,000 signal transmitting
pins per square centimeter employing the fabrication method
disclosed. The diameter of the signal transmitting pins and
the spacing therebetween are dimensioned as low as 20
nanometers when embedded in an electrical insulating matrix.
The charge transfer plate is used in many embodiments of
electrical equipment such as shown in a spatial light
modulator of figure 1, an electrical multifeedthrough assembly
of figure 5, and hermetically sealed electrical vacuum chamber
of figure 7.
Representative claims 5, 16 and 18 are reproduced as
follows:
5. In an electronic device having a high density charge
transfer plate made of an electrically insulating material and
an array of electrically conductive pins embedded therein, the
improvement residing in said pins being spaced from each other
and having diameters dimensionally providing a cross-sectional
charge transfer density substantially exceeding 900,000 pins
per square centimeter.
2
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