Appeal No. 97-0598
Application 08/322,670
16. In an electronic device having a high density charge
transfer plate made of an electrically insulating material and
an array of electrically conductive pins embedded therein, the
improvement residing in spacing between said pins being as low
as 20 nanometers and said electrically insulating material
being alumina while the pins are made of indium.
18. In an electronic device, a charge transfer plate
through which electrical signals are simultaneously
transmitted, including an electrically insulating matrix and
an array of electrically conductive wires embedded therein, a
pair of insulator bodies interfaced with said electrically
insulating matrix, electrically conductive inputs interfaced
between the insulator bodies and the electrically insulating
matrix in spaced relation to each other, and adjacent sets of
coplanar circuit chips embedded in said insulator bodies
operatively interconnected by the charge transfer plate.
The references relied on by the examiner are:
Galaj et al (Galaj) 4,946,592 Aug. 7,
1990
Suzuki 5,087,278 Feb. 11, 1992
No art rejection is on appeal.
Claims 5 through 8, 11 through 14, 16, 18 and 19 stand
rejected under 35 U.S.C. § 112, first paragraph.
Reference is made to Appellants' briefs and the2
Examiner's answer for their respective positions.3
2A reply brief was filed on July 17, 1996 [paper no. 15]
and was entered into the record.
3A supplemental answer was mailed on Aug. 19, 1996 [paper
no. 16].
3
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 Next
Last modified: November 3, 2007