Appeal No. 1997-0166
Application No. 08/409,933
BACKGROUND
The appellants' invention relates to a semiconductor device having a protruding bump electrode.
Specifically, a bump electrode (5a) is positioned above a semiconductor substrate (1). An electrode
pad (2a) and a metal layer (4a) are located between the bump electrode and substrate to allow signals
to be input and output to and from the semiconductor device. A resin film (6) covers a surface of the
substrate. The bump electrode is disposed in an opening (fig. 4) in the resin film and projects a distance
(fig. 7) above a top surface (8) of the resin film. An understanding of the invention can be derived from
a reading of exemplary claim 17, which is reproduced as follows:
17. A semiconductor device comprising: a semiconductor substrate;
at least one bump electrode positioned above the semiconductor substrate, the
bump electrode and semiconductor substrate having an electrode pad and metal layer
therebetween to allow signals to be input and output to and from the semiconductor
device; and
a resin film covering a surface of the semiconductor substrate, the resin film
having an opening positioned above the electrode pad, the bump electrode being
disposed in the opening of the resin film and projecting a distance above a top surface
of the resin film, said projection distance reducing heat induced defects and absorbing
pressure exerted on a top area of the bump electrode to suppress occurrence of cracks
in the resin film.
The prior art references of record relied upon by the examiner in rejecting the appealed
claims are:
Merrin et al. (Merrin) 3,436,818 Apr. 08, 1969
Engeler et al. (Engeler) 3,714,520 Jan. 30, 1973
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