Appeal No. 1997-3314
Application 08/266,783
process for coating a layer of chromium and then a layer of
copper onto a specified polyimide substrate. Appellants state
that the process is especially applicable for making
metallized integrated circuit substrates (specification, page
1, lines 12-13). Claim 1 is illustrative:
1. A process for providing a metallic layer on a
polyimide substrate which comprises providing a substrate of a
polyimide from diaryl dianhydride and a diamine; sputter
coating a layer of chromium of 200 angstroms or less on said
substrate at a deposition rate of about 4 angstroms/second or
less, and wherein the temperature of said polyimide substrate
during the sputtering is about 60EC or less and resulting in
improved adhesion, followed by coating a layer of copper on
said layer of chromium.
THE REFERENCES
Belke, Jr. et al. (Belke) 4,466,874 Aug. 21,
1984
Ho et al. (Ho) 4,720,401 Jan. 19,
1988
Sallo 4,863,808 Sep. 5,
1989
Clabes et al. (Clabes) 4,886,681 Dec. 12,
1989
Handbook of Adhesives 597-99 & 612-13 (Irving Skeist, ed., Van
Nostrand Reinhold 1977) (Skeist).
THE REJECTION
Claims 1-4 and 6-13 stand rejected under 35 U.S.C. § 103
as being unpatentable over Sallo in view of Skeist and Ho,
2
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