Appeal No. 1997-3635
Application No. 08/498,357
resistance of the barrier metallization layer is not
substantially increased.
The Examiner relies on the following references:
Wong et al. (Wong) 4,873,204 Oct. 10, 1989
Yu et al. (Yu) 4,977,098 Dec.
11, 1990
Zhang 5,236,850 Aug. 17,
1993
Whitten et al. (Whitten) 5,451,811
Sep. 19, 1995
Sato (Japan '414) 04-63414 Feb. 28, 1992
(published Japanese Patent Application)
Claims 1, 2, 4, 5, 9, 10, 12, 14, and 19 stand rejected
under 35 U.S.C. § 102 as being anticipated by Wong. Claims 3,
8, 15, and 16 stand rejected under 35 U.S.C. § 103 over Wong.
Claims 1 through 3, 5, 8, 9, 11, 12, 14, 16, and 19 stand
rejected under 35 U.S.C. § 103 over Yu and Japan '414. Claims
11 and 20 stand rejected under 35 U.S.C. § 103 over Wong and
Yu. Claim 6 stands rejected under 35 U.S.C. § 103 over Wong
and Whitten. Claim 17 stands rejected under 35 U.S.C. § 103
over Wong, Yu, and Whitten. Claim 7 stands rejected under 35
U.S.C. § 103 over Wong and Zhang. Claim 18 stands rejected
under 35 U.S.C. § 103 over Wong, Yu, and Zhang.
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