Ex parte LIPPEY et al. - Page 6




          Appeal No. 1998-0038                                                        
          Application No. 08/236,780                                                  


               invention, each individual application may call for                    
               a specific energy range in order to avoid initiating                   
               a sputtering reaction that would damage the                            
               substrate beneath the unwanted contaminant layer."                     
               [Emphasis added]                                                       
               Thus, it is respectfully submitted that the                            
               Champetier patent does not disclose or suggest                         
               sputtering a cryofilm off of a cryogenically cooled                    
               substrate as is taught and claimed in the present                      
               application, and specifically teaches away from                        
               sputtering.  The Examiner's position is in direct                      
               opposition with the above quoted teachings of the                      
               Champetier patent.                                                     
               We disagree with the appellants' interpretation of                     
          Champetier's disclosure at column 5, lines 44-49.  In our                   
          opinion, this disclosure does not teach an artisan to avoid                 
          initiating a sputtering reaction of any kind, as the                        
          appellants seem to believe.  Instead, this disclosure teaches               
          the artisan to avoid initiating a level or degree of                        
          sputtering reaction that would damage the substrate beneath                 
          the unwanted contaminant layer.  This last-mentioned                        
          interpretation is consistent with patentee's repeatedly                     
          expressed objective to remove contaminants while avoiding                   
          damage to the underlying substrate (e.g., see the paragraph                 
          bridging columns 2 and 3 as well as lines 57-61 in column 3).               
          Moreover, this objective of Champetier fully corresponds to                 

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