Ex parte KIHARA et al. - Page 2




                Appeal No. 1998-2147                                                                                                       
                Application No. 08/247,356                                                                                                 


                                                           BACKGROUND                                                                      

                          The invention is directed to a chemical amplification photosensitive                                             

                 composition comprising (i) an alkali-soluble polyvinylphenol resin having a softening                                     

                 point of at least 150oC and a weight average molecular weight which is no less than                                       

                 3,000 and exceeds 8,000 only when the photosensitive composition containing the                                           

                 resin has sufficient photosensitivity and forms a resist pattern which has sufficient                                     

                 resolution, (ii) an acid-decomposable compound and (iii) a compound which generates                                       

                 an acid when exposed to a chemical radiation.  Claims 36 and 37 which are                                                 

                 representative of the invention are reproduced below:                                                                     

                          36.     A chemical amplification photosensitive composition,                                                     
                          comprising:                                                                                                      

                                  an alkali-soluble polyvinylphenol resin having a softening point of                                      
                          at least 150oC and a weight average molecular weight which is no less                                            
                          than 3,000 and exceeds 8,000 only when the photosensitive composition                                            
                          containing the resin has sufficient photosensitivity and forms a resist                                          
                          pattern which has sufficient resolution;                                                                         

                                  an acid-decomposable compound; and                                                                       

                                  a compound which generates an acid when exposed to a                                                     
                          chemical radiation.                                                                                              






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