Ex parte MIYAMOTO - Page 1




          The opinion in support of the decision being entered today was not written for
                   publication and is not binding precedent of the Board.             
                                                            Paper No. 28              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
                              Ex parte TAKAAKI MIYAMOTO                               
                                    _____________                                     
                                Appeal No. 1998-2916                                  
                             Application No. 08/606,975                               
                                   ______________                                     
                                      ON BRIEF                                        
                                   _______________                                    

          Before FLEMING, RUGGIERO and GROSS, Administrative Patent                   
          Judges                                                                      
          RUGGIERO, Administrative Patent Judge.                                      


                                 DECISION ON APPEAL                                   

               This is a decision on the appeal from the final rejection              
          of claims 1-6 and 8-16, which are the only claims remaining in              
          the application.  Claim 7 has been canceled.                                
               The disclosed invention relates to a method of providing               
          a conductive metal layer in a contact hole in an insulating                 
          layer on a semiconductor substrate.  The contact hole is                    

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