Appeal No. 1999-0542
Application 08/760,557
titanium nitride applied over an aluminum alloy. Ishii
teaches a multi-layer metalization contact having titanium
nitride over tungsten which is over an aluminum alloy. The
examiner finds that these teachings suggest the obviousness of
the claimed multi-layer metalization of titanium nitride over
titanium which is over an aluminum alloy. The examiner cites
Ong to meet the vacuum chamber aspects of the claimed
invention. Finally, the examiner cites Watanabe and Nicolet
as teaching the interchangeability of refractory metals and
metal nitrides [answer, pages 6-11].
Appellants make a substantial number of arguments in
an attempt to point out errors in the examiner’s rejection.
For purposes of this appeal, we will focus only on the
following four features of the claimed invention:
1) preventing a formation of a layer having a
high resistance; while
2) in a vacuum chamber, successively and without
intervening interruption;
3) the aluminum alloy layer and the metal
nitride layer being conductively connected
together; and
4) the metallization continues to conduct even
if the aluminum alloy layer becomes non-
conducting.
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