The opinion in support of the decision being entered today was not
written for publication and is not binding precedent of the Board.
Paper No. 10
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte JOHN HUDAK and THOMAS R. NEAL
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Appeal No. 1999-2571
Application No. 08/820,200
____________
HEARD: October 11, 2001
____________
Before BARRETT, DIXON, and GROSS, Administrative Patent Judges.
GROSS, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the examiner's final
rejection of claims 1, 3, 5 through 11, and 13 through 19,
which are all of the claims pending in this application.
Appellants' invention relates to a method of making a
semiconductor device using an SOI starting wafer and thinning
process with a non-SOI semiconductor fabrication process
selected from CMOS, NMOS, PMOS, Bipolar, and BICMOS
fabrication processes. Claim 1 is illustrative of the claimed
invention, and it reads as follows:
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