Appeal No. 2000-0158
Application No. 08/782,872
A. The invention
The invention related to the soldering of pins onto an
electronic package. As shown in Appellant's Figures 4-6,
reproduced below, an electromagnet 5 and an apertured mask 1 are
used to pick up magnetic pins 7, dip the pins into a solder bath
9 so as to coat the exposed ends of the pins, and then bring the
ends of the pins into contact with solder pads or lands 13 on an
electronic package 15, after which heat is applied to cause the
solder on the pins to reflow and secure the pins to the package.
2
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Last modified: November 3, 2007