Appeal No. 2000-0158
Application No. 08/782,872
The examiner attempts to cure this deficiency by relying on
Ma's disclosed techniques for soldering pins 38 and 80 to an add-
on card 25 (Answer at 4). We will begin with pins 38 (Fig. 4),
which extend from the bottom surface of add-on card 25, the top,
bonding surface 30 (Fig. 3) of which has pads 28 and 32 for
soldering to leads 22 of a plastic quad flat pack (not shown).
Figs. 19 and 20 show the pins 38 mounted in holes 90 of
embodiments of add-on card boards having single-layer and double-
layer construction:
Ma does not coat the pins with solder before inserting them into
holes 90. Instead,
[s]older paste 91 is . . . placed in holes 90. After
applying the solder paste to the holes 90, preferably
filling them completely, the pins 38 are inserted. The
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Last modified: November 3, 2007