Appeal No. 2000-0158
Application No. 08/782,872
B. The claims
Claim 9, the sole independent claim on appeal, and dependent
claims 10 and 11, read as follows:2
9. A partially fabricated package which
comprises:
(a) a surface having a plurality of electrically
conductive bond pads thereon; and
(b) solder-coated solderable magnetic pins
contacting said bond pads, unsecured to said bond pads
and solderable to said bond pads.
10. The package of claim 9 wherein said pads are
one of solder pads or lands.
11. The package of claim 9 wherein each said
solder-coated magnetic pin is secured to said pad by
solder coated on said pin.
C. The references and ground of rejection
The examiner's rejection is based on the following
references:
Ma et al. (Ma) 5,486,723 (US) Jan. 23, 1996
(filed Nov. 7, 1994)
2 Claim 9 as reproduced herein is claim 9 as it appears in
the amendment dated September 3, 1997 (Paper No. 4). We note
that the January 23, 1998, amendment (Paper No. 6) to claim 9 has
physically been entered despite the examiner's Advisory Action
(Paper No. 7) refusing it entry.
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