Appeal No. 2000-0158
Application No. 08/782,872
Seyama3 64-71159 (JP) Mar. 16, 1989
Claims 9-16 stand rejected under 35 U.S.C. § 103(a) for
obviousness over Seyama in view of Ma.
Figures 1, 3, and 4 of Seyama show pins 2 of semiconductor
packages 1 soldered to pads 3-2 on substrates 3:
Before the pins' ends are brought into abutting contact with the
pads, the solder is applied to the substrate rather than being
applied to the pins, as is necessary to satisfy claim 1.
Translation at 5, 3rd full para.
3 Our understanding of this reference is based on the
November 1, 1999, translation prepared by the PTO Translations
Branch (copy enclosed).
4
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007