Appeal No. 2000-0158
Application No. 08/782,872
add-on card 25 with the pins 38 inserted is then
heated. This heating process melts the solder
surrounding the base of the pin.
Ma, column 8, lines 35-39. The pins are connected to soldering
pads 28 (Fig. 3) by unshown circuitry between the board layers
and on the bonding surface 30 of the add-on card (col. 8, ll. 41-
43).
Nor are the heads 82 of Ma's pins 80 (Fig. 13) coated with
solder before being secured to pin pads 84 on add-on card 25's
board 36 (Fig. 15):
(Fig. 3)
Instead, Ma explains that
[u]sing a stencil matching the pin layout of the PGA
socket, a thin layer of solder paste is disposed on the
pin pads 84. The fixture containing the pins 80 is
then placed on the add-on card 25. . . .
Once the fixture is placed on the add-on card 25,
the assembly is placed in a reflow oven (not shown)
that melts the solder, thereby securing the pins 82 to
the add-on card 25.
Ma, column 8, line 67 to column 9, line 14.
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