Appeal No. 2000-0424
Application 08/760,510
DECISION ON APPEAL
This is a decision on appeal under 35 U.S.C. § 134 from
the final rejection of claims 4 and 8, the only claims
pending.
We reverse.
BACKGROUND
The invention relates to a laminate printed circuit board
having a lead for plating. The problem with leads for plating
in the prior art shown in Figs. 2A and 2B was that when the
leads 3 were cut off after plating, the residual potions 4
were deformed and were apt to short-circuit nearby terminals.
The problem is solved by using a single lead on the printed
circuit board connected to the terminals to be plated and then
disconnecting the terminals from each other by a hole through
the lead. Claim 4 is directed to the embodiment of
Figs. 3A-3C and claim 8 is directed to the embodiment of Figs.
4A and 4B.
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