Appeal No. 2000-0424
Application 08/760,510
being used "for plating." Yasuda says nothing that would have
suggested the Examiner's proposed modification of providing a
plurality of plated conductors/wirings/BTHs, where the BTHs
are interconnected by a lead extending a different direction
than the conductors, and certainly does not disclose or
suggest further modifying the Examiner's modification to sever
the lead (conductor layer 34 in the rejection) between BTHs.
The Examiner's statement that the lead is shown as severed
between holes in Yasuda because it only extends a short
distance to either side of the hole is not consistent with the
Examiner's rejection where the BTHs are arrayed along a lead
(conductor layer 34) out of the plane of the paper. Figure 6
only shows the width of the lead (conductor layer 34); it does
not show the lead severed between BTHs which were connected at
one time for the purpose of plating.
Contrary to the Examiner's statement that the hole
passing through the lead is not a claim limitation, claim 4
expressly recites "each hole . . . extending through said lead
so that said adjacent ones of said plurality of BTHs are not
interconnected through said lead." The Examiner erred in
dismissing arguments to this limitation as moot.
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