Appeal No. 2000-0424
Application 08/760,510
not connected, and because claim 8 first recites the lead is
connected to a plurality of conductors and then recites that
nearby connectors are not connected through the lead (FR2).
It is not clear why the rejection was withdrawn.
Nevertheless, the claim language is explained by the product-
by-process interpretation. In claim 4, corresponding to
Figs. 3A-3C, initially a plurality of BTHs are connected by a
lead which is used for plating (Fig. 3A), then holes are
formed to sever the lead between BTHs (Figs. 3B & 3C).
Claim 4
We summarize the Examiner's rejection, as best
understood, with respect to Fig. 6 of Yasuda as marked up by
the Examiner in Appendix B (there is no Appendix A) attached
to the examiner's answer. The portion of conductor layer 46
to the left of blind hole 48 is a "conductor[] provided on
said laminate printed circuit board . . . extending in a first
direction and toward an edge of said printed circuit board."
The conductor is "plated" as shown by plating layer 49
(col. 11, lines 23-26). The portion of conductor layer 46 to
the right of blind hole 48 is "wiring[] respectively connected
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