Appeal No. 2000-2001
Application No. 09/172,732
improve the adhesion between the dielectric substrate and the
heat spreader, a layer of a codeposited ZnCr is provided
intermediate the dielectric substrate and the heat spreader. In
addition, the present invention is concerned with electronic
packages that include an integrated circuit chip surrounded by a
dielectric, a heat spreader located adjacent to the dielectric
substrate and a layer of codeposited ZnCr intermediate the
dielectric substrate and the heat spreader. The present
invention is also concerned with the process for fabricating the
above defined article. In particular, the process of the present
invention involves providing a layer of a codeposited ZnCr on at
least one major surface of a heat spreader, and then laminating
the heat spreader to a dielectric substrate.
The following claim further illustrates the invention:
1. An article comprising a dielectric substrate; a heat
spreader located adjacent said dielectric substrate; and a layer
of ZnCr intermediate said dielectric substrate and said heat
spreader for enhancing adhesion between said dielectric substrate
and said metallic heat spreader.
The Examiner relies on the following references:
Miyamoto 4,876,588 Oct. 24, 1989
Applicants’ admitted prior art
2
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