Appeal No. 2000-2001
Application No. 09/172,732
of these patents show the use of ZnCr layer as enhancing adhesion
between a heat spreader and the substrate with a chip. The
Examiner responds (Examiner’s answer at page 7 and 8) that “[t]he
fact that a layer of ZnCr enhances adhesiveness in an electronic
components (sic) with different adhesives was inherent for one
[of] ordinary skill [] ....” The Examiner further alleges (id.
at 8) that the above-cited references which Appellants describe
in relation to the “official notice” show that the adhesiveness
for the “improvement of a tarnish resistance is not the end in
itself but a mechanism of enhancing the adhesiveness in an (sic)
electronic components with different adhesives.” The Examiner
admits (id. at 8) that none of these references relates to the
adhering of a dielectric substrate to a heat sink or spreader,
however, all of these references are “related to the ZnCr coating
layer being used to enhance the adhesion between two different
electronic and heat dissipating components and different
adhesives which is exactly what the proposed invention is about.”
The Examiner concludes that he considers the cited references as
sufficient evidence to prove that the recited enhanced adhesion
was an inherent characteristic of
the particular type of commerically available heat spreader
containing ZnCr.
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