Ex Parte FULLER et al - Page 7



          Appeal No. 2000-2001                                                        
          Application No. 09/172,732                                                  

               The Federal Circuit has held [t]o establish inherency, the            
          extrinsic evidence ‘must make clear that the missing descriptive            
          matter is necessarily present in the thing described in the                 
          reference, and that it would be so recognized by person of                  
          ordinary skill.’” In re Robertson, Slip Op 98-1270 (Fed. Cir.               
          February 25, 1999) citing Continental Can Co v. Monsanto Co.,               
          948 F.2d 1264, 1268, 20 USPQ2d 1746, 1749 (Fed. Cir. 1991).                 
          "Inherency, however, may not be established by probabilities or             
          possibilities.  The mere fact that a certain thing may result               
          for a given set of circumstances is not sufficient." Id. citing             
          Continental Can Co v. Monsanto Co., 948 F.2d 1264, 1269,                    
          20 USPQ2d 1746, 1749 (Fed. Cir. 1991).                                      
               Following the guidelines of the Federal Circuit, we are                
          not convinced that the Examiner has shown adequate extrinsic                
          evidence by citing these references that inherency exists in the            
          use of a ZnCr intermediate layer for use as a layer for enhancing           
          adhesion between a heat spreader and the substrate.  There may              
          exist a good possibility or even a good probability that ZnCr               
          having know adhesive characteristic may be used as one of the               
          many ways or layers which will not only provide a good adhesion             
          between the heat spreader and the substrate but also will provide           
          a good heat transfer between the electronic components and the              
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