Appeal No. 2001-0014 Page 7
Application No. 09/070,899
container by using the chip itself to form one of the walls in
a hermetic enclosure.
In response to the appellant’s arguments, the examiner
states that Chen is relied upon for showing chip-to-substrate
bonding to produce an hermetic seal and VanZeghbroeck is
relied on to teach solder bonding (answer, p. 5). The
examiner points out that the relationship between the seal and
the electrical connection to the outside of the package is not
relevant to Chen. The examiner further argues that the reason
for combining the noted teachings from each reference is based
on known techniques that desire hermetically sealing of
devices from environmental effects (answer, p. 6).
As pointed out by our reviewing court, we must first
determine the scope of the claim. “[T]he name of the game is
the claim.” In re Hiniker Co., 150 F.3d 1362, 1369, 47 USPQ2d
1523, 1529 (Fed. Cir. 1998). Claims will be given their
broadest reasonable interpretation consistent with the
specification, and limitation appearing in the specification
are not to be read into
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