Appeal No. 2001-0014 Page 14
Application No. 09/070,899
module formed by attaching a detector array to a laser array
using solder bumps without any concern for hermetically
sealing the module. Finally, Chen provides a method of
hermetically sealing an electrical feedthrough line by bonding
a semiconductor chip to an insulating substrate in a pressure
sensor. Chen, in fact, is concerned with sealing the
feedthrough line between the chip and the substrate in an
insulating bonding layer and requires neither active devices
on the semiconductor chip nor contacts to such devices by
electrically conductive vias extending through the thickness
of the ceramic substrate. Therefore, we find no reason or
suggestion for combining various teachings from these
references, as set forth by the examiner, to arrive at the
appellant’s claimed invention. In our view, the only
suggestion for modifying Sato ‘566 and ‘414, VanZeghbroeck and
Chen in the manner proposed by the examiner to meet the above-
noted limitations stems from hindsight knowledge derived from
the appellant’s own disclosure. As noted above, the use of
such hindsight knowledge to support an obviousness rejection
under 35 U.S.C. § 103 is, of course, impermissible.
We fail to find any suggestion or teachings to use Chen’s
sealed feedthrough in combination with Sato ‘566,
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