Appeal No. 2001-0014 Page 15
Application No. 09/070,899
VanZeghbroeck and Sato ‘414 such that the opto-electronic chip
may be bonded
with solder face down on a substrate as recited in the
appellant’s claim 6. Therefor, we reverse the rejection of
claims 6 and 7 under 35 U.S.C. § 103 over Sato ‘566 and ‘414,
VanZeghbroeck and Chen. Edwards does not cure the above-
mentioned deficiencies with respect to the rejection of claim
6. Accordingly, the rejection of claim 8 under 35 U.S.C. §
103 is reversed.
CONCLUSION
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