Appeal No. 2001-0014 Page 10
Application No. 09/070,899
that regard, while Sato ‘566 discloses a ceramic substrate
with a die attach area and a number of contact pins on one
surface of the substrate (Fig. 5A and col. 10, lines 6-24),
the reference does not teach or suggest bonding the chip face
down with solder upon a ceramic substrate to hermetically seal
the chip-substrate enclosure. Furthermore, we do not find
contact pins 3 to be extending through the thickness of the
ceramic substrate. Figure 17 of Sato ‘566, at the best,
merely discloses conductive vias extending through the
thickness of package base 31 while chip 32 is bonded face up
to package cap 34 and heat radiating member 35. Additionally,
we find that the hermetic sealing of the package is achieved
by bonding the perimeter of cap 34 to base 31 not by bonding
the chip to the substrate so as to constitute an hermetic
enclosure.
VanZeghbroeck discloses an optoelectric detector array
and a laser array that are physically and electrically
connected to each other with solder bumps forming electrical
contacts between the circuitry on the detector array and
individual lasers on the laser array (col. 3, lines 60-62).
Sato ‘414 also relates to an optoelectric device including an
array of PIN photo diodes. However, we find that neither
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