Ex Parte MILLER et al - Page 1




                       The opinion in support of the decision being entered today was not written
                   for publication and is not binding precedent of the Board.         

                                                                 Paper No. 15         

                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                               Ex parte GAYLE W. MILLER                               
                                  and GAIL D. SHELTON                                 
                                     ____________                                     
                                 Appeal No. 2001-1064                                 
                              Application No. 09/164,069                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     
          Before FLEMING, RUGGIERO, and GROSS, Administrative Patent Judges.          
          RUGGIERO, Administrative Patent Judge.                                      


                                  DECISION ON APPEAL                                  
               This is a decision on the appeal from the final rejection of           
          claims 6-17, which are all of the claims pending in the present             
          application.  Claims 1-5 have been canceled.                                
               The disclosed invention relates to a dielectric layer formed           
          within a semiconductor structure in which a layer of silica                 
          precursor material is initially deposited on a silicon substrate.           
          The layer of silica precursor material is then dried and becomes a          
          porous silica film.  A protective layer, such as parylene, is               
          formed on top of the dried porous silica film resulting in a                





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