Appeal No. 2001-1064
Application No. 09/164,069
suggest a dielectric layer structure including a composite layer,
formed by a combination of a parylene layer and a porous silica
layer, disposed between the parylene layer and the porous silica
layer as presently claimed.
After careful review of the applied Lu and Sivaramakrishnam
references, in light of the arguments of record, we are in general
agreement with Appellants’ position as stated in the Brief.
Although the Examiner points to portions of Lu (column 7, lines
59-67 through column 8, lines 1-5) which, in the Examiner’s view,
suggest the use of parylene as an alternative to the HSQ layer 144,
our review of this portion of Lu reveals a clear difference in
application procedures between the HSQ and parylene embodiments.
In Lu, the HSQ material is used as a pore filling material which
fills the pores 512 of the xerogel or porous silica layer 510
creating a composite layer of HSQ and xerogel. An entirely
different approach is taken by Lu, however, when using parylene.
As indicated by Lu (column 7, lines 59-67), “[r]ather than apply a
pore filling material such as HSQ 144" an alternative surface
activation adhesion approach is used which treats the surface of
the xerogel layer with a plasma of hydrogen and argon. The
resultant hydrided surface of the xerogel layer acts to provide
good adhesion for dielectric materials such as parylene. A further
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