Appeal No. 2002-0508
Application No. 09/225,116
The subject matter on appeal relates to an integrated
circuit device (claims 1-7, 10, 11, and 23) and to a
semiconductor device comprising at least one microcavity within
a layer of the device (claims 13-19). Further details of this
appealed subject matter are recited in representative claims 1
and 13 (the only independent claims on appeal) as well as
representative claims 2 and 3 reproduced below:
1. An integrated circuit device comprising:
a substrate layer;
a plurality of raised features on said substrate
layer, said raised features having an aspect ratio;
a microcavity layer on said substrate layer, said
microcavity layer containing at least one microcavity,
said microcavity defined by said raised features and
surrounded by said microcavity layer;
a pinning layer on said microcavity layer, said
pinning layer covering the microcavity layer and the
at least one microcavity.
2. The integrated circuit device of claim 1,
wherein the microcavity has a frustoconical bottom
portion.
3. The integrated circuit device of claim 1,
wherein the microcavity has a cylindrical upper
portion.
13. A semiconductor device comprising at least
one microcavity within a layer of the device, said
microcavity having a portion characterized by non-
parallel side walls.
2
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