Ex Parte CRONIN et al - Page 6


         Appeal No. 2002-0508                                                       
         Application No. 09/225,116                                                 

         1429, 1431 (Fed. Cir. 1997); accord Glaxo Inc. v. Novopharm                
         Ltd., 52 F.3d 1043, 1047, 34 USPQ2d 1565, 1567 (Fed. Cir. 1995).           
              Also, it is well settled that, in proceedings before the              
         United States Patent and Trademark Office (PTO), claims in an              
         application must be given their broadest reasonable                        
         interpretation, taking into account the written description                
         found in the specification.  In re Morris, 127 F.3d 1048, 1054,            
         44 USPQ2d 1023, 1027 (Fed. Cir. 1997); In re Zletz, 893 F.2d               
         319, 321-22, 13 USPQ2d 1320, 1322 (Fed. Cir. 1989).  That is,              
         “[w]hen the applicants state the meaning that the claim terms              
         are intended to have, the claims are examined with that                    
         meaning...”  Zletz, 893 F.2d 321, 13 USPQ2d at 1322.                       
              Here, appealed claim 1 recites the term “pinning layer.”              
         According to the specification, “[t]he pinning layer 16 changes            
         the shape of the void.”  (Page 8, lines 12-13.)  In addition,              
         the specification enlightens one skilled in the relevant art as            
         follows (id. at lines 14-21):                                              
              The layer 16 is formed from a relatively high density                 
              material such as silicon dioxide (SiO2), phosphorus                   
              doped SiO2, boron phosphorus doped SiO2, or any                       
              material which would shrink less than the layer 14                    
              during the anneal, adheres well to the layer 14, and                  
              is fairly rigid such that it does not expand or shrink                
              during the anneal relative to layer 14.  Such                         
              materials include sputtered silicon, silicon nitride,                 
              CVD or sputtered metal.                                               



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