Appeal No. 2001-1118
Application 09/262,690
by insulating layers. Electrical connection can be made between the different levels of
conductive lines by means of vias which extend through the insulating layers to the conductive
lines. The vias are filled with metal to form a stud. Prior to filling the via with a conductive
material, a liner layer is deposited on the side walls and bottom of the via, such as to form a
barrier in between the conductive metal deposited in the via and the insulative layers.
According to the involved application, the material used for the liner layer tends to be
resistive and because of its presence on the bottom of the via adds to the overall resistance of the
conductive stud. Such added resistance is not desirable, since it leads to slower propagation of
electrical signals.
The claimed invention attempts to solve the problem of the added resistance by removing
the bottom layer of the liner. The applicants have claimed a semiconductor article having a
material with a via. A first layer is deposited in the via and a second layer is deposited on the
first layer. During the sputtering process of depositing the second layer on the first layer, the first
layer deposited on the bottom of the via is “substantially removed,” while the first layer
deposited on the sidewalls remains on the sidewalls.
B. Findings of Fact
1. The applicants state that the real party in interest is International Business
Machines Corporation. (Brief at 2).
2. The application on appeal contains claims 11-27.
3. Claims 1-10 have been cancelled.
4. Claims 11, 13, 14, 16 and 17 have been rejected as being anticipated under 35
2
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