The opinion in support of the decision being entered today was not written for
publication and is not binding precedent of the Board.
Paper No.
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte KOZO SHIMIZY, MASAYUKI OCHIAI
and YASUO YAMAGISHI
____________
Appeal No. 2004-0777
Application No. 09/731,726
____________
ON BRIEF
____________
Before KRATZ, TIMM, and JEFFREY T. SMITH, Administrative Patent
Judges.
KRATZ, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the examiner's final
rejection of claims 1-6, 15 and 16, which are all of the claims
pending in this application.
BACKGROUND
Appellants' invention relates to a semiconductor including a
solder alloy of a specified composition forming bump(s) for
bonding semiconductor elements to a substrate. An understanding
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