Appeal No. 2004-0777 Page 2
Application No. 09/731,726
of the invention can be derived from a reading of exemplary claim
4, which is reproduced below.
4. A circuit substrate comprising semiconductor elements bonded
thereon through bumps made of a solder alloy,
said solder alloy being an Sn-Ag-based alloy having Sn
content of 90(wt%) or more and its Ag content within the range of
1.5 (wt%) to 2.8 (wt%), the amount of Y rays in Sn being 0.01
(cph/cm2) or less.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Bult et al. (Bult) 4,690,725 Sep. 01, 1987
Ogashiwa et al. (Ogashiwa) 6,160,224 Dec. 12, 2000
(Filing Date May 12, 1998)
Akamatsu et al. (Akamatsu)1 09-260427 Mar. 10, 1997
(published Japanese Patent Application)
Claims 1-6 stand rejected under 35 U.S.C. § 103(a) as being
unpatentable over Ogashiwa in view of Akamatsu. Claims 15 and 16
stand rejected under 35 U.S.C. § 103(a) as being unpatentable
over Ogashiwa in view of Akamatsu and Bult.
We refer to the briefs and to the answer for a complete
exposition of the opposing viewpoints expressed by appellants and
the examiner concerning the issues before us on this appeal.
1 All references to Akamatsu in this decision are to the
English language translation of the published Japanese
application, of record.
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