Appeal No. 2004-0777 Page 3
Application No. 09/731,726
OPINION
Having carefully considered each of appellants* arguments
set forth in the briefs and the evidence of record, appellants
have not persuaded us of reversible error on the part of the
examiner. Accordingly, we affirm the examiner’s rejections for
substantially the reasons set forth by the examiner in the
answer. We add the following for emphasis.
Appellants state that the appealed claims stand or fall
together (brief, page 4). Consequently, we select claim 1 as the
representative claim on which we decide this appeal as to the
examiner’s first stated ground of rejection.
Ogashiwa teaches joining an electronic component to a
substrate with a solder bump made of an alloy including, inter
alia, tin and silver in amounts inclusive of the claimed amounts.
See, e.g., column 1, line 59 through column 2, line 19 of
Ogashiwa. As evidenced by the embodiment 13 solder composition
set forth in Table 1 of Ogashiwa, the use of a solder comprising
92 % tin is disclosed, an amount of tin encompassing the greater
than 90 weight percent tin recited in representative claim 1.
Akamatsu discloses semiconductor devices including substrate
bonded elements using solder bumps made of a tin alloy that also
includes silver, the tin being disclosed as being used in amounts
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