Ex Parte Mulligan et al - Page 16



          Appeal No. 2004-0999                                                        
          Application No. 09/997,086                                                  

                                Rejection of Claim 17                                 
               Dependent claim 17 is rejected under 35 U.S.C. § 103 as                
          being obvious over Ibnabdeljalil in view of Igarashi and further            
          in view of Mori.  As set forth above, we find that Mori does not            
          teach the forming of at least one trench through an interconnect            
          layer.  Consequently, the combination of Ibnabdeljalil, Igarashi,           
          and Mori does not teach or suggest "forming at least one wide               
          trench through said microelectronic device wafer interconnect               
          layer within said at least one dicing street" required in claim             
          17.  Therefore, we will not sustain the rejection of claim 17.              
                                Rejection of Claim 18                                 
               Dependent claim 18 is rejected under 35 U.S.C. § 103 as                
          being obvious over Ibnabdeljalil in view of Igarashi and Mori and           
          further in view of Wolf.  We find that Wolf teaches plasma                  
          etching to form trenches as Examiner pointed out on page 8 of the           
          answer.  However, Wolf does not teach forming at least one trench           
          through an interconnect layer.  Consequently, the combination of            
          Ibnabdeljalil, Igarashi, Mori, and Wolf does not teach or suggest           
          the step of "forming at least one wide trench through said                  
          microelectronic device wafer interconnect layer within said at              

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