Appeal No. 2004-0999 Application No. 09/997,086 Rejection of Claim 17 Dependent claim 17 is rejected under 35 U.S.C. § 103 as being obvious over Ibnabdeljalil in view of Igarashi and further in view of Mori. As set forth above, we find that Mori does not teach the forming of at least one trench through an interconnect layer. Consequently, the combination of Ibnabdeljalil, Igarashi, and Mori does not teach or suggest "forming at least one wide trench through said microelectronic device wafer interconnect layer within said at least one dicing street" required in claim 17. Therefore, we will not sustain the rejection of claim 17. Rejection of Claim 18 Dependent claim 18 is rejected under 35 U.S.C. § 103 as being obvious over Ibnabdeljalil in view of Igarashi and Mori and further in view of Wolf. We find that Wolf teaches plasma etching to form trenches as Examiner pointed out on page 8 of the answer. However, Wolf does not teach forming at least one trench through an interconnect layer. Consequently, the combination of Ibnabdeljalil, Igarashi, Mori, and Wolf does not teach or suggest the step of "forming at least one wide trench through said microelectronic device wafer interconnect layer within said at 16Page: Previous 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 NextLast modified: November 3, 2007