Ex Parte Tsai et al - Page 5




                    Appeal No. 2004-1123                                                                                                                                  
                    Application No. 09/933,503                                                                                                                            


                    Like the examiner, we view the patents to Baseman, Roberson,                                                                                          
                    Parikh and Brooks applied in the rejection before us on appeal as                                                                                     
                    also addressing contamination problems, similar to those noted by                                                                                     
                    appellants, in SMIF pods and other wafer storage containers.  In                                                                                      
                    that regard, Brooks (col. 1) mentions the need for removing                                                                                           
                    contaminants such as "moisture, oxygen, ion contaminants and the                                                                                      
                    like" from a wafer storage container interior and maintaining the                                                                                     
                    interior contaminant free for an extended period of time.  Brooks                                                                                     
                    expressly notes that, due to the ever increasing sensitivity of                                                                                       
                    semiconductor wafers, the presence of even infinitesimal amounts                                                                                      
                    of contaminants is a drawback to quality production and the                                                                                           
                    elimination of rejects.  In Brooks, column 1, lines 42-49, it is                                                                                      
                    indicated that one known form of protection is to use a                                                                                               
                    desiccant, such as Silica Gel, prepackaged in a vapor                                                                                                 
                    transmission type material which is placed within the plastic                                                                                         
                    wafer storage container prior to sealing thereof.  The desiccant                                                                                      
                    is said to act to absorb atmospheric contaminants such as                                                                                             
                    moisture vapor and oxygen during packaging and storage of wafers.                                                                                     
                    However, Brooks further notes that desiccants have a relatively                                                                                       
                    limited shelf-life and therefore may eventually require time                                                                                          
                    consuming and expensive repackaging and replacement.  Thus,                                                                                           
                    Brooks proposes an alternative purging method and apparatus which                                                                                     

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