Appeal No. 2004-1123
Application No. 09/933,503
permits periodic removal of contaminants from the wafer package
interior during extended storage thereof. Although Brooks
emphasizes that even "infinitesimal" amounts of contaminants can
adversely effect wafer quality, this patent does not mention any
specific level of contaminants, such as moisture, oxygen, ion
contaminants, etc., that would be acceptable.
Similar to Brooks, Roberson recognizes that it is desirable
in a wafer storage SMIF pod used in processing and storage of
semiconductor wafers to achieve a desirable level of relative
humidity, oxygen and particulates. Roberson proposes a purging
system to achieve desired levels of contaminants within the
storage pod and notes that, ideally, the SMIF pod should be
completely purged to desired levels of relative humidity, oxygen,
etc., specifically indicating that relative humidity levels of
about 0.1% or less have been achieved (col. 6, lines 33-37).
Baseman discloses a SMIF pod used to protect semiconductor
wafers during manufacture, storage and transport. Similar to the
prior art in column 1 of Brooks, Baseman uses a pre-formed vapor
removal element disposed within the SMIF pod to absorb vapors
inside the closed pod (see, e.g., element (30) in Figs. 6A, 7, 8,
66
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