Ex Parte SANDHU - Page 35




                                nitride films, and the 15 % decrease in resistivity for the metal nitride sample                            
                                film C5 plasma treated using a power of 100 watts and without substrate                                     
                                biasing, one of ordinary skill in the art would be able to practice a method of                             
                                post-treating a metal nitride layer with a hydrogen gas plasma to reduce the                                
                                carbon concentration and decrease the resistivity of such layer, as required by                             
                                Leung claims 13, 19, 20 and 26.                                                                             
                LX 2021, pp. 4-6, ¶ 11.                                                                                                     
                        We do not agree that the record establishes that the 143 Specification describes a “more than                       
                negligible improvement” or even any improvement at all over the control film.  Other “control” films                        
                said to have been  deposited under the same conditions (Application 09/128,143, Specification, p. 10,                       
                ll. 15-16) were reported as having an average resistivity of 11,360 :ohm-cm (Application 09/128,143,                        
                Specification, p. 9, ll. 21-22).  Thus, the control samples reported in the 143 Specification which were                    
                said to have been made by identical processes show substantial variation in resistivity between around                      
                11,000 and 16,000 :ohm-cm.  The resistivity reported for Example C5 is within this range at 13,500.                         
                Thus, it is not apparent that the resistivity decrease asserted for Example C5 resulted from the pre- and                   
                post-treatment with a hydrogen plasma rather than the normal sample to sample variation in resistivity.                     
                We do not credit Dr. Chang’s testimony that Example C5 shows that an unbiased plasma treatment                              
                results in a 15% reduction in resistivity.  Dr. Chang did not account for the resistivities of the other                    
                control samples said to have been made by the same process.                                                                 
                        In any event, even if the hydrogen plasma treatment resulted in an actual reduction in                              
                resistivity, no information is provided as to any reduction in the carbon content resulting from the                        
                plasma-only treatment.   Indeed, the 143 Specification states that the treatments did not effect carbon                     
                content. Application 09/128,143, Specification, p. 14, ll. 10-12.  Nor does the 143 Specification                           
                describe the effect of the hydrogen plasma treatment on stability, one of the stated goals of the                           
                invention.                                                                                                                  
                        Leung argues that the fact situation is controlled by In re Brower, 433 F.2d 813, 167 USPQ                          
                684 (CCPA 1970). Paper 104, pp. 11-13.   That case is inapposite with respect to the written                                
                description issue.  The issue in Brower was whether the earlier application was an enabling disclosure                      
                of the  invention claimed in the later application.  In reversing the rejection the court stated:                           
                                Considering the disclosure appellants’ parent application in this light, we find                            
                                that it contains an enabling disclosure of the invention now claimed.                                       


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