The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte CHEE KIANG YEW and MASAZUMI AMAGAI
____________
Appeal No. 2005-2530
Application No. 10/612,1291
____________
ON BRIEF
____________
Before JERRY SMITH, KRASS and SAADAT, Administrative Patent Judges.
SAADAT, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the Examiner’s final
rejection of claims 1, 2 and 4-15. Claim 3 has been allowed and
claims 16-32 have been cancelled.
We affirm.
BACKGROUND
Appellants’ invention relates to a method of assembling an
integrated circuit chip to an electrically insulating substrate
1 Application for patent filed July 2, 2003, which according to
Appellants, is a divisional of Application No. 09/401,572, filed September 22,
1999, now U.S. Patent No. 6,602,803.
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