Appeal No. 2005-2530 Application No. 10/612,129 non-conductive adhesive layer 142 (col. 4, lines 55-59). Lupinski, on the other hand relates to using a plasticized polymer useful as a low temperature laminating adhesive for circuit manufacturing (abstract, col. 1, lines 6-8). As depicted in the Figure, Lupinski laminates an overlay dielectric layer 50 to substrate 10 having IC chip 30 attached thereon using a plasticized polyetherimide composition 40 in order to provide void free adhesive bonding at low temperature (col. 2, lines 9- 18). Based on our findings above, we disagree with Appellants’ arguments and conclusion that the combination is improper since the substrate disclosed by Lupinski has no relationship to contact pads. Both references are concerned with using an adhesive for attaching an insulating substrate to the active surface of a semiconductor chip. Specifically, as argued by the Examiner (answer, page 8), the polymeric adhesive disclosed by Lupinski provides void free adhesive bonding in a low temperature process. We also remain unconvinced by Appellants’ argument that Lupinski needs to show that insulating layer 50 includes conductive strips and contact pads on the surface to be bonded with the active surface of an integrated circuit chip for a 6Page: Previous 1 2 3 4 5 6 7 8 9 10 NextLast modified: November 3, 2007