Ex Parte Yew et al - Page 5



          Appeal No. 2005-2530                                                        
          Application No. 10/612,129                                                  
          claimed subject matter to one of ordinary skill in the art.  See            
          In re Bell, 991 F.2d 781, 783, 26 USPQ2d 1529, 1531 (Fed. Cir.              
          1993); In re Fritch, 972 F.2d 1260, 1266 n.14, 23 USPQ2d 1780,              
          1783-84 n.14 (Fed. Cir. 1992); Uniroyal, Inc. v. Rudkin-Wiley               
          Corp., 837 F.2d 1044, 1051, 5 USPQ2d 1434, 1438 (Fed. Cir. 1988);           
          Ashland Oil, Inc. v. Delta Resins & Refractories, Inc., 776 F.2d            
          281, 293, 227 USPQ 657, 664 (Fed. Cir. 1985).  In considering the           
          question of the obviousness of the claimed invention in view of             
          the prior art relied upon, the Examiner is expected to make the             
          factual determination set forth in Graham v. John Deere Co., 383            
          U.S. 1, 17, 148 USPQ 459, 467 (1966), and to provide a reason why           
          one having ordinary skill in the pertinent art would have been              
          led to modify the prior art or to combine prior art references to           
          arrive at the claimed invention.  See also In re Rouffet, 149               
          F.3d 1350, 1355, 47 USPQ2d 1453, 1456 (Fed. Cir. 1998).                     
               A review of Lee confirms that the reference relates to a               
          chip scale package including an insulating substrate with a first           
          surface for bonding with the surface of a semiconductor circuit             
          chip (col. 2, lines 17-21).  As shown in Figure 2 of Lee, the top           
          surface of a circuit substrate 120a, which includes conductive              
          traces for connection to a semiconductor chip, is attached to the           
          surface of semiconductor chip 130 bearing contact pads 131 using            

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