Appeal No. 2005-2530
Application No. 10/612,129
using a preactivated polymer adhesive layer in a variety of
different semiconductor chip scale (SCS) packages.
Representative independent claim 1 is reproduced as follows:
1. A semiconductor device comprising:
an integrated circuit chip having an active and a
passive surface, said active surface
including a protective polymer layer having been
preactivated to impart adhesiveness, and at least one
bonding pad;
an electrically insulating substrate having first and
second surfaces;
a plurality of electrically conductive routing strips
integral with said substrate;
a plurality of contact pads disposed on said first
surface of said substrate, at least one of said contact pads
electrically connected with at least one of said routing
strips;
said second surface of said substrate being directly
attached to said preactivated polymer layer; and
bonding wires electrically connecting said at least one
bonding pad to at least one of said contact pads.
The prior art references of record relied upon by the
Examiner in rejecting the appealed claims are:
U.S. Patents
Lupinski et al. (Lupinski) 5,300,812 Apr. 5, 1994
Lee et al. (Lee) 6,013,946 Jan. 11, 2000
(filed Mar. 31, 1997)
Japanese Published Application
Hiroshi 06-029454 Feb. 4, 1994
2
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