Appeal No. 2006-0103 Page 5
Application No. 10/172,892
(PDMS). The method of attachment can be lamination, injection molding[,] gluing or any
other means, or the gasket layer can be held in place by the clamping force.” Page 11,
paragraph [0158].
Chen’s Figure 18 is reproduced below:
The figure shows an “embodiment [in which] the cover slip can be flat and have a thick
gasket layer bonded to the bottom surface. The gasket layer has openings which form
the wells.” Page 11, paragraph [0162].
Chen’s Figure 19 is reproduced below:
The figure is said to show how, “[i]n various embodiments, during hybridization, the cover
slip is placed upside down and such that the wells face up. . . . Sample or target liquid is
added to the wells (FIG. 19a). Then the microarray substrate slide is placed upside
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