Appeal No. 2006-1333
Application No. 10/347,849
with improved step coverage in high aspect ratio openings and to optimize the process.”
Further, in discussing the deposition process parameters involved in filling a 0.25
um width hole, as presently claimed, Venkatesan states the following (column 9, line 65
through column 10, line 5):
In this way, the doping characteristics, step
coverage, and deposition rate of each layer
112 and 114 of the composite film 110 are optimized,
according to the single parameter X, to suit a
particular purpose in order to optimize the
entire process. In this way, the novel parameter
(X) can be utilized to maximize wafer throughput
and ensure complete hole filling under all
manufacturing requirements.
It is well settled that "[W]here the general conditions of a claim are disclosed in the
prior art, it is not inventive to discover the optimum or workable ranges by routine
experimentation." In re Aller, 220 F.2d 454, 456, 105 USPQ 233, 235 (CCPA 1955)
(Claimed process which was performed at a temperature between 40°C and 80°C and an
acid concentration between 25% and 70% was held to be prima facie obvious over a
reference process which differed from the claims only in that the reference process was
performed at a temperature of 100°C and an acid concentration of 10%.); see also
Peterson, 315 F.3d at 1330, 65 USPQ2d at 1382 ("The normal desire of scientists or
artisans to improve upon what is already generally known provides the motivation to
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