Appeal No. 2006-1467 Page 2
Application No. 10/302,271
a transducer in the assembly or more generally holds a transducer
component in electrical connection with a conductor. The air gun
is turned on and the previously solder-connected component is
removed when the solder ball melts. The assembly may be loaded
on a fixture during the solder ball debounding process.
Exemplary claims 1 and 4 are reproduced below.
1. A method for debounding a magnetic head
transducer from a head gimbal assembly, said magnetic
head transducer being bounded to said head gimbal
assembly by a solder ball, which is formed by solder
ball bounding process, said method comprising:
loading the head gimbal assembly on a fixture;
directing a hot air gun to the solder ball of the
head gimbal assembly and turn on the hot air gun; and
taking away the magnetic head from the suspension
when the solder ball melts.
4. A method for debounding a magnetic head
transducer from an electrical conductor, said magnetic
head transducer having been bounded in an electrical
connection with said electrical conductor by solder
ball bounding process, said method comprising:
directing a hot air gun to the electrical
connection of the head gimbal assembly;
turning on the hot air gun; and
taking away the magnetic head transducer when the
connection melts.
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Last modified: November 3, 2007