Appeal No. 2006-1467 Page 5
Application No. 10/302,271
disclose employing a fixture for holding the gimbal during the
rework process.
The examiner turns to Kirkland for teaching the use of hot
gases, such as hot air, for melting a solder ball, as part of a
repair process. Kirkland discloses using a repair system,
including nozzles (86) and (90), for directing hot air to solder
ball(s). The directed hot air melts the solder as part of a
repair process of an integrated circuit component package. A
solder ball bounded defective electrical component is removed
from a circuit board in Kirkland for replacement with an operable
component. See drawing Figures 4 and 5 and the corresponding
text of Kirkland.
Moreover, the examiner refers to Kolesar for disclosing the
use of a fixture for holding an electronic circuit assembly
during a rework process involving the melting of solder balls to
remove defective components.
According to the examiner, it would have been obvious to one
of ordinary skill in the art at the time of the invention to
employ nozzles (guns) for directing and turning on the flow of
hot gases, as taught by Kirkland, as the method for melting the
solder ball in the gimbal head rework process of Sluzewski.
Moreover, the examiner has found that it would have been obvious
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