Appeal 2006-2351
Application 10/645,493
We AFFIRM.
INTRODUCTION
Appellant claims a method for planarizing and polishing surfaces in
the microelectronics industry (Specification 1). Appellant’s method includes
providing a liquid polish slurry composition comprising abrasive particles on
the surface and contacting the surface with a polishing pad that consists
essentially of a polymeric matrix and solid lubricant particles in an amount
sufficient to reduce friction between the pad and surface during planarizing
(claim 17).
Claims 17, 24, 32, and 34 are illustrative:
17. A method for planarizing a surface which is formed on a substrate
which comprises providing on the surface to be planarized a liquid polish
slurry composition comprising abrasive particles;
and contacting said surface with a polishing pad that consists
essentially of a polymeric matrix and solid lubricant particles in an amount
sufficient to reduce friction between the pad and surface during planarizing.
24. The method of claim 17, wherein the amount of solid lubricant
particles is about 0.5 to about 30% by weight.
32. The method of claim 17, wherein said lubricant particles
comprises at least one member selected from the group consisting of a
binding agent, coupling agent or adhesive promoter.
34. A method according to claim 17, wherein the surface to be
polished contains at least one low-k dielectric selected from the group
consisting [sic of] low-k porous dielectric, low-k non-porous dielectric and
air bridges and combinations thereof.
2
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