Ex Parte Stockman et al - Page 2

               Appeal 2006-2769                                                                             
               Application 09/846,980                                                                       

               I.  APPEALED SUBJECT MATTER                                                                  
                      The subject matter on appeal is directed to a method of producing                     
               p-type III-V nitride layers in a light emitting diode (Specification 1 and 4).               
               Further details of the appealed subject matter are recited in representative                 
               claims 1 and 31,1 which are reproduced below:                                                
               1.  A method for manufacturing a p-type III-V nitride compound                               
               semiconductor comprising:                                                                    
               growing in a chamber a III-V nitride compound semiconductor layer                            
               at a first temperature while introducing acceptor impurities into said layer to              
               form an acceptor-doped layer, said chamber containing one or more gases                      
               providing hydrogen such that said hydrogen passivates at least some of said                  
               acceptor impurities;                                                                         
               cooling said acceptor-doped layer to a second temperature                                    
               significantly lower than said first temperature during a cool–down process;                  
               preventing additional hydrogen from diffusing into said acceptor-                            
               doped layer substantially during the cool-down process;                                      
               causing said acceptor-doped layer to be a p-type layer, having p-type                        
               conductivity and a hold density between approximately 3x1015cm-3 and                         
               1x1018cm-3, after said cool-down process; and                                                
               after said cooling, heating said p-type layer to a third temperature                         
               greater than the second temperature and less than 625ºC to remove hydrogen                   
               from said p-type later thereby increasing said hole density and lowering the                 
               resistivity of said p-type layer.                                                            




                                                                                                           
               1 The Appellants only argue the limitations recited in claims 1 and 31 in the                
               Brief and the Reply Brief (Br. 4-7 and Reply Br. 1-4).                                       
                                                     2                                                      

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