Appeal No. 2007-0068
Application No. 10/230,452
INTRODUCTION
Appellant’s invention relates to a multi-chip module in which two or
more semiconductor devices are vertically stacked such that the distance
between the adjacent devices is determined, at least in part, by the heights of
the discrete conductive elements such as bond wires that protrude above an
active surface of the lower device. Claim 1 is illustrative:
1. A semiconductor device assembly, comprising:
a first semiconductor device;
discrete conductive elements extending over portions of an active
surface of the first semiconductor device; and
a second semiconductor device positioned at least partially over the
first semiconductor device and resting upon the discrete conductive elements
in electrical isolation therefrom.
The Examiner relies on the following prior art references to show
unpatentability:
Lee et al. (Lee) US 6,388,313 May 14, 2002
(filed Jan. 30, 2001)
Wu et al. (Wu) US 6,400,007 Jun. 4, 2002
(filed Apr. 16, 2001)
Shim et al. (Shim) US 6,531,784 Mar. 11, 2003
(filed Jun. 2, 2000)
Kondo et al. (Kondo) US 6,545,365 Apr. 8, 2003
(filed Feb. 13, 2001)
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: September 9, 2013