Ex Parte Derderian - Page 5

                Appeal No. 2007-0068                                                                          
                Application No. 10/230,452                                                                    

                1999); In re Paulsen, 30 F.3d 1475, 1478-79, 31 USPQ2d 1671, 1673 (Fed.                       
                Cir. 1994).  The inquiry as to whether a reference anticipates a claim must                   
                focus on what subject matter is encompassed by the claim and what subject                     
                matter is described by the reference.  As set forth by the court in Kalman v.                 
                Kimberly-Clark Corp., 713 F.2d 760, 772, 218 USPQ 781, 789 (Fed. Cir.                         
                1983), it is only necessary for the claims to “‘read on’ something disclosed                  
                in the prior art reference, i.e., all limitations of the claim are found in the               
                reference, or ‘fully met’ by it.”  See also Atlas Powder Co. v. IRECO Inc.,                   
                190 F.3d at 1346, 51 USPQ2d at 1945 (Fed. Cir. 1999) (quoting Titanium                        
                Metals Corp. v. Banner, 778 F.2d 775, 781, 227 USPQ 773, 778 (Fed. Cir.                       
                1985)).                                                                                       
                      As pointed out by the Examiner (Answer 11), since the wires are in                      
                contact with the upper semiconductor chip, the upper chip actually rests                      
                upon the wires.  Similarly, we remain unconvinced by Appellant’s argument                     
                that Figure 4 of Wu lacks sufficient detail related to the elements positioned                
                between the upper chip and the lower chip and fails to show the claimed                       
                structure.  We find depicted in Figure 3, in sufficient details, all the elements             
                over the lower chip that would support the upper chip, such as bond wires 32                  
                and overflow glue 50 which form the dam-shape bumps at the upper edges                        


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