Appeal 2007-0123
Application 10/408,939
thermal interface to a heat-generating electronic component. Independent
claim 1 is illustrative of the invention and is reproduced below:
1. A thermoplastic, thermally-conductive composition,
comprising:
a) about 20% to about 80% by weight of a thermoplastic
elastomer matrix, said matrix forming a network;
b) about 25% to about 60% by weight of a first thermally-
conductive, filler material having an aspect ratio of about 10:1 or
greater;
c) about 5 to about 50% by weight of a phase change
material, said phase change material being capable of changing from a
solid state to a liquid state and from a liquid state to a solid state
within a temperature range of about 10ēC to about 115ēC; and
d) about 10% to about 25% by weight of a second thermally-
conductive, filler material having an aspect ratio of about 5:1 or less,
wherein the composition has a thermal conductivity of greater than 3
W/mēK,
wherein said phase change material is contained within said
network formed by said elastomer matrix such that said phase change
material in said liquid state is retained in said network thereby
preventing said liquid phase change material from flowing out of said
network within said composition.
The Examiner relies on the following prior art references to show
unpatentability:
MuCullough US 6,048,919 Apr. 11, 2000
Duvall US 6,391,442 B1 May 21, 2002
The Examiner made the following rejection:
Claims 1-10 under 35 U.S.C. § 103(a) as unpatentable over Duvall in
view of McCullough.
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